cystech electronics corp. spec. no. : c302c2 issued date : 2014.06.30 revised date : 2015.01.07 page no. : 1/6 BAT54C2 cystek product specification 0.2a surface mount schottky diode BAT54C2 features ? high current capability, low forward voltage drop ? high surge current capability ? guardring for over voltage protection ? low power loss, high efficiency ? ultra high-speed switching ? low profile surface mounted package in order to minimize board space mechanical data ? case : molded plastic, sc-79/sod523. ? epoxy : ul94-v0 rated flame retardant ? terminals : plated terminals, solderable per mil-std-750 method 2026. ? polarity : indicated by cathode band. ? mounting position : any. symbol outline BAT54C2 ordering information device package shipping BAT54C2-0-t5-g sod-523 (pb-free lead plating and halogen-free package) 8000 pcs / tape & reel environment friendly grade : s for rohs compliant products, g for rohs compliant and green compound products packing spec, t5 : 8000 pcs / tape & reel, 7? reel product rank, zero for no rank products product name
cystech electronics corp. spec. no. : c302c2 issued date : 2014.06.30 revised date : 2015.01.07 page no. : 2/6 BAT54C2 cystek product specification absolute maximum ratings (t a =25 , unless otherwise noted) parameters conditions symbol value units repetitive peak reverse voltage v rrm 30 rms voltage v rms 21 continuous reverse voltage v r 30 v forward rectified current i f 0.2 repetitive peak forward current i fm 0.3 non-repetitive peak forward current i fsm 0.6 a total device dissipation t a =25c (note) p d 200 mw thermal resistance junction to ambient (note) r t ja 625 qc/w storage temperature range tstg -65 ~ +175 qc operating junction temperature range tj -65 ~ +150 qc note : when device mounted on fr-5 pcb with minimum pad. characteristics (t a =25 q c) characteristic symbol condition min. typ max. unit reverse breakdown voltage v br i r =100 a 30 - - v v f 1 i f =0.1ma - - 240 v f 2 i f =1ma - - 320 v f 3 i f =10ma - - 400 v f 4 i f =30ma - - 500 forward voltage v f 5 i f =100ma - - 800 mv reverse leakage current (note 2) i r v r =30v - - 2 a diode capacitance c d v r =1v, f=1mhz - - 10 pf reverse recovery time trr i f =i r =10ma r l =100 : measured at i r =1ma - - 5 ns
cystech electronics corp. spec. no. : c302c2 issued date : 2014.06.30 revised date : 2015.01.07 page no. : 3/6 BAT54C2 cystek product specification typical characteristics diode capacitance & reverse-biased voltage 1 10 100 0.1 1 10 100 reverse biased voltage-v r (v) diode capacitance-cd (pf) forward current & forward voltage 0 50 100 150 200 250 0 200 400 600 800 1000 forward voltage-v f (mv) forward current-i f (ma) recommended footprint
cystech electronics corp. spec. no. : c302c2 issued date : 2014.06.30 revised date : 2015.01.07 page no. : 4/6 BAT54C2 cystek product specification reel dimension carrier tape dimension
cystech electronics corp. spec. no. : c302c2 issued date : 2014.06.30 revised date : 2015.01.07 page no. : 5/6 BAT54C2 cystek product specification recommended wave soldering condition product peak temperature soldering time pb-free devices 260 +0/-5 c 5 +1/-1 seconds recommended temperature profile for ir reflow profile feature sn-pb eutectic assembly pb-free assembly average ramp-up rate (tsmax to tp) 3 c/second max. 3 c/second max. preheat ? temperature min(t s min) ? temperature max(t s max) ? time(ts min to ts max ) 100 c 150 c 60-120 seconds 150 c 200 c 60-180 seconds time maintained above: ? temperature (t l ) ? time (t l ) 183 c 60-150 seconds 217 c 60-150 seconds peak temperature(t p ) 240 +0/-5 c 260 +0/-5 c time within 5 c of actual peak temperature(tp) 10-30 seconds 20-40 seconds ramp down rate 6 c/second max. 6 c/second max. time 25 c to peak temperature 6 minutes max. 8 minutes max. note : all temperatures refer to topside of the package, measured on the package body surface.
cystech electronics corp. spec. no. : c302c2 issued date : 2014.06.30 revised date : 2015.01.07 page no. : 6/6 BAT54C2 cystek product specification sod-523 dimension 1 2 style : pin 1. cathode 2. anode 2-lead sod-523 plastic package cystek packa g e code : c2 marking code : 1 2 jv *: typical millimeters inches millimeters inches dim min. max. min. max. dim min. min. max. min. max. a 0.510 0.770 0.020 0.031 e 1.100 1.300 0.043 0.051 a1 0.500 0.700 0.020 0.028 e1 1.500 1.700 0.059 0.067 b 0.250 0.350 0.010 0.014 e2 0.200 ref 0.008 ref c 0.080 0.150 0.003 0.006 l 0.010 0.070 0.001 0.003 d 0.750 0.850 0.030 0.033 7 ref 7 ref notes: 1.maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 2.if there is any question with packing spec ification or packing method, please cont act your local cystek sales office. material: ? lead: pure tin plated. ? mold compound: epoxy resin family, flammability solid burning class: ul94v-0. important notice: ? all rights are reserved. reproduction in whole or in part is prohibited without the prior written approval of cystek. ? cystek reserves the right to make changes to its products without notice. ? cystek semiconductor products are not warranted to be suitab le for use in life-support applications, or systems. ? cystek assumes no liability for any consequence of customer pr oduct design, infringement of pat ents, or application assistance .
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